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MTA8ATF2G64HZ-3G2E2

MTA8ATF2G64HZ-3G2E2

Micron Technology

Description:

DRAM Module DDR4 SDRAM 16Gbyte 260SODIMM Tray

Introduction date:

Jun 25, 2019

Updated: 15-MAR-2024


See moreMemory Modules by Micron Technology

Online version: https://www.datasheets.com/part-details/mta8atf2g64hz-3g2e2-micron-technology-416900890

overviewOverview

Familiarize yourself with the fundamental general information, properties, and characteristics of the component, along with its compliance with industry standards and regulations.

LifeCycleinfo
EU RoHS
rohs yesYes
RoHS Version
2011/65/EU, 2015/863
ECCNinfo
4A994.a
Automotive
noNo
Supplier Cage Codeinfo
6Y440
HTSUSAinfo
8473301140
Schedule Binfo
8473300002
Category Path
Semiconductor > Memory > Memory Cards and Modules > Memory Modules

pdfDatasheet

Get a comprehensive understanding of the electronic component by downloading its datasheet. This PDF document includes all the necessary details, such as product overview, features, specifications, ratings, diagrams, applications, and more.

Datasheet Preview

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buy onlineBuy now

By purchasing the component directly from our verified distributors, you can enjoy a convenient and secure buying experience, with the assurance that you are obtaining genuine components from trustworthy sources.

Distributor

Stock

Price

Arrow Europe

Recommended

Arrow Europe
248

$61.01

Min. Quantity: 1
Verical
Verical
248

$61.0099

Min. Quantity: 1

packagePackage

The package information for the component gives important details about the product's size, weight, and packaging. This helps engineers determine if the product meets their requirements and expectations.

Basic Package Type
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Package Family Name
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Supplier Package
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Package Description
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Lead Shape
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Pin Count
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PCB
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Tabinfo
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Package Length (mm)info
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Package Width (mm)info
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Package Height (mm)info
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Seated Plane Height (mm)info
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Pin Pitch (mm)info
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Package Diameter (mm)
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Package Weight (g)
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Package Material
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Mounting
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Package Outline
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Package Orientation Marking Type
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Package Orientation
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Jedec
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manufacturingManufacturing

The manufacturing information specifies the technical requirements and specifications for producing and assembling the component. This information is crucial for manufacturers to maintain the quality and reliability of the components, and ensure they are compatible with other devices and components.

MSLinfo
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Maximum Reflow Temperature (°C)info
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Reflow Solder Time (Sec)info
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Number of Reflow Cycleinfo
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Standardinfo
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Maximum Wave Temperature (°C)info
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Wave Solder Time (Sec)info
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parametricParametric

The parametric information displays vital features and performance metrics of the component, which helps engineers and supply chain managers to compare and choose the most appropriate electronic component for their applications and needs.

Product Line
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Warranty
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Maximum Refresh Cycle Time
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Process Technology
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Minimum Storage Temperature
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Refresh Cycles
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Self Refresh
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Module Sides
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PLL
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Number of Module Banks
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SPD EEPROM Support
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Number of Chip Banks
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PC Type
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Maximum Storage Temperature
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Total Density in Bits
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Supplier Temperature Grade
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Main Category
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Total Density
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Subcategory
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Maximum Clock Rate
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Maximum Access Time
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Organization
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Number of Chip per Module
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Chip Density
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Module Type
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Data Bus Width
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Chip Configuration
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ECC Support
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Number of Ranks
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Chip Package Type
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Typical Operating Supply Voltage
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Minimum Operating Supply Voltage
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Maximum Operating Supply Voltage
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Maximum Operating Current
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CAS Latency
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Minimum Operating Temperature
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Maximum Operating Temperature
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MTA8ATF2G64HZ-3G2E2

MTA8ATF2G64HZ-3G2E2By Micron Technology