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overviewOverview

Familiarize yourself with the fundamental general information, properties, and characteristics of the component, along with its compliance with industry standards and regulations.

LifeCycleinfo
EU RoHS
rohs yesYes
RoHS Version
2011/65/EU, 2015/863
ECCNinfo
5A992
Automotive
rohs unknownUnknown
Supplier Cage Codeinfo
H1R01
HTSUSAinfo
8473301180
Schedule Binfo
8473300002
Category Path
Semiconductor > Development Systems > Evaluation, Development Boards and Kits > RF/Wireless Development Boards and Kits

pdfDatasheet

Get a comprehensive understanding of the electronic component by downloading its datasheet. This PDF document includes all the necessary details, such as product overview, features, specifications, ratings, diagrams, applications, and more.

Datasheet Preview

(Latest Version)

manufacturingManufacturing

The manufacturing information specifies the technical requirements and specifications for producing and assembling the component. This information is crucial for manufacturers to maintain the quality and reliability of the components, and ensure they are compatible with other devices and components.

MSLinfo
infolock
Maximum Reflow Temperature (°C)info
infolock
Reflow Solder Time (Sec)info
infolock
Number of Reflow Cycleinfo
infolock
Maximum Wave Temperature (°C)info
infolock
Wave Solder Time (Sec)info
infolock
Lead Finish(Plating)info
infolock
Under Plating Materialinfo
infolock
Terminal Base Materialinfo
infolock
OM5571/N5122S01,69

OM5571/N5122S01,69By NXP Semiconductors