SAA7140BH
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Description:

High Performance Multimedia IC

Updated: +90 days


See moreMultimedia Misc by NXP Semiconductors

Online version: https://www.datasheets.com/part-details/saa7140bh-nxp-semiconductors-60334388

overviewOverview

Familiarize yourself with the fundamental general information, properties, and characteristics of the component, along with its compliance with industry standards and regulations.

LifeCycleinfo
EU RoHS
rohs unknownUnknown
RoHS Version
2011/65/EU
Automotive
rohs unknownUnknown
Supplier Cage Codeinfo
H2J65
HTSUSAinfo
8542390001
Category Path
Semiconductor > Multimedia > Other > Multimedia Misc

pdfDatasheet

Get a comprehensive understanding of the electronic component by downloading its datasheet. This PDF document includes all the necessary details, such as product overview, features, specifications, ratings, diagrams, applications, and more.

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packagePackage

The package information for the component gives important details about the product's size, weight, and packaging. This helps engineers determine if the product meets their requirements and expectations.

Supplier Package
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Pin Count
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PCB
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Tabinfo
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Package Length (mm)info
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Package Width (mm)info
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Package Height (mm)info
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Pin Pitch (mm)info
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Package Diameter (mm)
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Package Material
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Mounting
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Jedec
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manufacturingManufacturing

The manufacturing information specifies the technical requirements and specifications for producing and assembling the component. This information is crucial for manufacturers to maintain the quality and reliability of the components, and ensure they are compatible with other devices and components.

MSLinfo
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Maximum Reflow Temperature (°C)info
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Reflow Solder Time (Sec)info
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Number of Reflow Cycleinfo
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Standardinfo
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Reflow Temp. Source
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Maximum Wave Temperature (°C)info
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Wave Solder Time (Sec)info
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Wave Temp. Source
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Lead Finish(Plating)info
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Under Plating Materialinfo
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Terminal Base Materialinfo
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SAA7140BH

SAA7140BHBy NXP Semiconductors