SN74LS32N

Datasheet

Get a comprehensive understanding of the electronic component by downloading its datasheet. This PDF document includes all the necessary details, such as product overview, features, specifications, ratings, diagrams, applications, and more.

Supplier Datasheet
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Datasheet Preview

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Package

The package information for the component gives important details about the product's size, weight, and packaging. This helps engineers determine if the product meets their requirements and expectations.

Basic Package Type

Package Family Name

Supplier Package

Package Description

Lead Shape

Pin Count

PCB

Tab

Package Length (mm)

Package Width (mm)

Package Height (mm)

Seated Plane Height (mm)

Pin Pitch (mm)

Package Diameter (mm)

Package Weight (g)

Package Material

Mounting

Package Outline

Package Overall Height (mm)

Package Orientation Marking Type

Package Orientation

Package Overall Width (mm)

Package Overall Length (mm)

Jedec

Jedec info (PKG outline)

Manufacturing

The manufacturing information specifies the technical requirements and specifications for producing and assembling the component. This information is crucial for manufacturers to maintain the quality and reliability of the components, and ensure they are compatible with other devices and components.

MSL

Maximum Reflow Temperature (°C)

Reflow Solder Time (Sec)

Number of Reflow Cycle

Standard

Maximum Wave Temperature (°C)

Wave Solder Time (Sec)

Wave Temp. Source

Lead Finish(Plating)

Under Plating Material

Terminal Base Material

Parametric

The parametric information displays vital features and performance metrics of the component, which helps engineers and supply chain managers to compare and choose the most appropriate electronic component for their applications and needs.

Product Line

Maximum Supply Current

Maximum Storage Temperature

Typical Quiescent Current

Maximum Quiescent Current

Supplier Temperature Grade

Input Type

Absolute Propagation Delay Time

Minimum High Level Input Voltage

Maximum Input Leakage Current

Maximum Low Level Output Voltage

Maximum Low Level Input Voltage

Minimum High Level Output Voltage

Propagation Delay Test Condition

Number of Output Enables per Element

Maximum High Level Output Current

Maximum Low Level Output Current

Minimum Storage Temperature

Number of Selection Inputs per Element

Maximum Propagation Delay Time @ Maximum CL

Typical Supply Current

Logic Family

Logic Function

Process Technology

Number of Elements per Chip

Number of Element Inputs

Number of Element Outputs

Output Type

Minimum Operating Temperature

Maximum Operating Temperature

Minimum Operating Supply Voltage

Typical Operating Supply Voltage

Maximum Operating Supply Voltage

CAD Models

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Crosses

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