STM32F334C8T6

Datasheet

Get a comprehensive understanding of the electronic component by downloading its datasheet. This PDF document includes all the necessary details, such as product overview, features, specifications, ratings, diagrams, applications, and more.

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Package

The package information for the component gives important details about the product's size, weight, and packaging. This helps engineers determine if the product meets their requirements and expectations.

Basic Package Type

Package Family Name

Supplier Package

Package Description

Lead Shape

Pin Count

PCB

Tab

Package Length (mm)

Package Width (mm)

Package Height (mm)

Seated Plane Height (mm)

Pin Pitch (mm)

Package Diameter (mm)

Package Material

Mounting

Package Outline

Jedec

Jedec info (PKG outline)

Manufacturing

The manufacturing information specifies the technical requirements and specifications for producing and assembling the component. This information is crucial for manufacturers to maintain the quality and reliability of the components, and ensure they are compatible with other devices and components.

MSL

Maximum Reflow Temperature (°C)

Reflow Solder Time (Sec)

Number of Reflow Cycle

Standard

Reflow Temp. Source

Maximum Wave Temperature (°C)

Wave Solder Time (Sec)

Lead Finish(Plating)

Under Plating Material

Terminal Base Material

Parametric

The parametric information displays vital features and performance metrics of the component, which helps engineers and supply chain managers to compare and choose the most appropriate electronic component for their applications and needs.

Product Line

Maximum Expanded Memory Size

Operating Supply Voltage

Supplier Temperature Grade

Minimum Storage Temperature

Parallel Master Port

Real Time Clock

Timers Channels

Maximum Storage Temperature

Temperature Flag

Special Features

Maximum Power Dissipation

Display Driver

Data Memory Size

Analog Comparators

Watchdog

PWM

LCD Segments

Hardware Acceleration

Trace Hardware

Maximum Dhrystone MIPS

Encryption Standard

DMA Channels

CAN Type

EEPROM

Instruction Cache Size

Data Cache Size

Direct Memory Access

Floating Point Unit

Bluetooth

Wi-Fi

Timers Resolution

Multiply Accumulate

Input Capture Channels

Output Compare Channels

Internal/External Clock Type

Touch Sensing Interface

Power On Reset

Memory Protection Unit

Temperature Sensor

DDR

Memory Management Unit

Integrated Development Environment

Super Scalar

External Bus Interface

Solutions

ISM Band

Ethernet Interface Type

Ethernet Speed

Process Technology

Tradename

LIN

Number of Cores

Family Name

Core Architecture

Device Core

Data Bus Width

Instruction Set Architecture

Maximum Clock Rate

Maximum CPU Frequency

Program Memory Type

Program Memory Size

RAM Size

Number of ADCs

ADC Channels

ADC Resolution

Number of DACs

DAC Channels

DAC Resolution

Number of Timers

Number of Programmable I/Os

Minimum Operating Supply Voltage

Typical Operating Supply Voltage

Maximum Operating Supply Voltage

Interface Type

CAN

I2C

SPI

Ethernet

UART

USART

USB

I2S

Programmability

Minimum Operating Temperature

Maximum Operating Temperature

Reference designs

Unlock inspiration and guidance with our collection of reference designs. Explore practical implementations showcasing the capabilities of the electronic component. Accelerate your development process and create efficient solutions with detailed documentation and schematics.

STM32F3348-DISCO, 32F3348DISCOVERY Discovery kit with STM32F334R8 MCU

STEVAL-ISA147V2, Evaluation Board for 500-W fully digital AC-DC power supply (D-SMPS) based on STM32F334C8 MCU

STEVAL-ISA147V3, Evaluation Board for 500-W fully digital AC-DC power supply (D-SMPS) based on STM32F334C8 MCU

STEVAL-ISA172V1, 2kW Fully Digital AC-DC Power Supply (D-SMPS) Evaluation Board

CAD Models

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Crosses

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