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TLP3521(C,F)

TLP3521(C,F)Toshiba


Description:

Solid State Relay 50mA 1.3V DC-IN 1A 400V AC-OUT 10-Pin PDIP

Country of Origin:

Japan

Introduction date:

May 16, 2001

Updated: +90 days


See moreSolid State Relays - SSRs by Toshiba

Online version: https://www.datasheets.com/part-details/tlp3521-c-f--toshiba-51374110

overviewOverview

Familiarize yourself with the fundamental general information, properties, and characteristics of the component, along with its compliance with industry standards and regulations.

LifeCycleinfo
EU RoHS
rohs yesYes
RoHS Version
2002/95/EC
ECCNinfo
EAR99
Automotive
noNo
Supplier Cage Codeinfo
J2925
HTSUSAinfo
8536410060
Schedule Binfo
8536410030
PPAP
noNo
AEC Qualified
noNo
Category Path
Electrical and Electronic Components > Electromechanical > Relays and Solenoids > Solid State Relays - SSRs

pdfDatasheet

Get a comprehensive understanding of the electronic component by downloading its datasheet. This PDF document includes all the necessary details, such as product overview, features, specifications, ratings, diagrams, applications, and more.

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packagePackage

The package information for the component gives important details about the product's size, weight, and packaging. This helps engineers determine if the product meets their requirements and expectations.

Basic Package Type
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Package Family Name
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Supplier Package
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Package Description
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Lead Shape
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Pin Count
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PCB
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Tabinfo
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Package Length (mm)info
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Package Width (mm)info
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Package Height (mm)info
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Seated Plane Height (mm)info
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Pin Pitch (mm)info
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Package Diameter (mm)
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Package Material
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Mounting
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Package Outline
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Package Overall Height (mm)
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Package Overall Width (mm)
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Package Overall Length (mm)
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manufacturingManufacturing

The manufacturing information specifies the technical requirements and specifications for producing and assembling the component. This information is crucial for manufacturers to maintain the quality and reliability of the components, and ensure they are compatible with other devices and components.

MSLinfo
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Maximum Reflow Temperature (°C)info
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Reflow Solder Time (Sec)info
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Reflow Temp. Source
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Maximum Wave Temperature (°C)info
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Wave Solder Time (Sec)info
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Wave Temp. Source
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Lead Finish(Plating)info
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Under Plating Materialinfo
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Terminal Base Materialinfo
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parametricParametric

The parametric information displays vital features and performance metrics of the component, which helps engineers and supply chain managers to compare and choose the most appropriate electronic component for their applications and needs.

Product Line
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Process Technology
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Minimum Storage Temperature
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Maximum On-State Voltage Drop
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Typical Input to Output Capacitance
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Minimum Load Current
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Maximum On Resistance
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Maximum Power Dissipation
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Minimum Input Voltage
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Maximum Storage Temperature
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Supplier Temperature Grade
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Maximum Input Voltage
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I/O Isolation Voltage
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Maximum Output Voltage
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Maximum Input Current
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Peak Non-Repetitive Surge Current
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Maximum Output Current
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Input Type
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Output Device
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Output Type
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Maximum Turn-Off Time
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Maximum Turn-On Time
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Circuit Arrangement
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Maximum Off-State Leakage Current
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Minimum Operating Temperature
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Maximum Operating Temperature
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electrical circuitReference designs

Unlock inspiration and guidance with our collection of reference designs. Explore practical implementations showcasing the capabilities of the electronic component. Accelerate your development process and create efficient solutions with detailed documentation and schematics.

TLP3521(C,F)

TLP3521(C,F)By Toshiba