TMS28F800AVB70CDCDL

TMS28F800AVB70CDCDL

Texas Instruments
Grade Your BOM

Description:

Flash Parallel 3V 8M-bit 1M x 8/512K x 16 70ns 48-Pin TSOP

Introduction date:

Nov 1, 1997

Updated: +90 days


See moreFlash by Texas Instruments

Online version: https://www.datasheets.com/part-details/tms28f800avb70cdcdl-texas-instruments-17877223

overviewOverview

Familiarize yourself with the fundamental general information, properties, and characteristics of the component, along with its compliance with industry standards and regulations.

LifeCycleinfo
EU RoHS
noNo
RoHS Version
2011/65/EU, 2015/863
ECCNinfo
EAR99
Automotive
noNo
Supplier Cage Codeinfo
01295
HTSUSAinfo
8542320071
Schedule Binfo
8542320070
Category Path
Semiconductor > Memory > Memory Chips > Flash

pdfDatasheet

Get a comprehensive understanding of the electronic component by downloading its datasheet. This PDF document includes all the necessary details, such as product overview, features, specifications, ratings, diagrams, applications, and more.

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packagePackage

The package information for the component gives important details about the product's size, weight, and packaging. This helps engineers determine if the product meets their requirements and expectations.

Basic Package Type
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Package Family Name
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Supplier Package
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Package Description
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Lead Shape
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Pin Count
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PCB
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Tabinfo
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Package Length (mm)info
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Package Width (mm)info
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Package Height (mm)info
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Package Diameter (mm)
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Package Material
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Mounting
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Package Outline
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Jedec
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Jedec info (PKG outline)
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manufacturingManufacturing

The manufacturing information specifies the technical requirements and specifications for producing and assembling the component. This information is crucial for manufacturers to maintain the quality and reliability of the components, and ensure they are compatible with other devices and components.

MSLinfo
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Maximum Reflow Temperature (°C)info
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Reflow Solder Time (Sec)info
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Number of Reflow Cycleinfo
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Standardinfo
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Maximum Wave Temperature (°C)info
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Wave Solder Time (Sec)info
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Lead Finish(Plating)info
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Under Plating Materialinfo
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Terminal Base Materialinfo
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parametricParametric

The parametric information displays vital features and performance metrics of the component, which helps engineers and supply chain managers to compare and choose the most appropriate electronic component for their applications and needs.

Product Line
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I/O Mode
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Maximum Cycle Time
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Process Technology
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Tradename
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Sector Size
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Density in Bits
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Command Compatible
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Bank Size
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Number of Banks
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Support of Page Mode
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Maximum Page Access Time
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Support of Common Flash Interface
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OE Access Time
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Simultaneous Read/Write Support
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Erase Suspend/Resume Modes Support
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ECC Support
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Page Read Current
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Program Current
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Page Size
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Programmability
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MMC Version
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Minimum Endurance
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Minimum Storage Temperature
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Maximum Storage Temperature
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Supplier Temperature Grade
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Density
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Cell Type
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Interface Type
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Timing Type
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Number of Words
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Number of Bits per Word
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Maximum Operating Frequency
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Maximum Access Time
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Maximum Erase Time
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Maximum Programming Time
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Typical Operating Supply Voltage
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Minimum Operating Supply Voltage
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Maximum Operating Supply Voltage
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Architecture
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Programming Voltage
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Boot Block
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Location of Boot Block
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Maximum Operating Current
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Block Organization
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Address Bus Width
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Minimum Operating Temperature
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Maximum Operating Temperature
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TMS28F800AVB70CDCDL

TMS28F800AVB70CDCDLBy Texas Instruments