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overviewOverview

Familiarize yourself with the fundamental general information, properties, and characteristics of the component, along with its compliance with industry standards and regulations.

LifeCycleinfo
EU RoHS
rohs unknownUnknown
RoHS Version
2011/65/EU
Automotive
rohs unknownUnknown
Supplier Cage Codeinfo
01295
HTSUSAinfo
8542310001
Category Path
Semiconductor > Microcontrollers and Processors > Processors > Digital Signal Processors - DSPs

pdfDatasheet

Get a comprehensive understanding of the electronic component by downloading its datasheet. This PDF document includes all the necessary details, such as product overview, features, specifications, ratings, diagrams, applications, and more.

Datasheet Preview

(Latest Version)

packagePackage

The package information for the component gives important details about the product's size, weight, and packaging. This helps engineers determine if the product meets their requirements and expectations.

Supplier Package
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Pin Count
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PCB
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Tabinfo
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Package Length (mm)info
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Package Width (mm)info
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Package Height (mm)info
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Pin Pitch (mm)info
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Package Diameter (mm)
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Package Material
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Mounting
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Jedec
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manufacturingManufacturing

The manufacturing information specifies the technical requirements and specifications for producing and assembling the component. This information is crucial for manufacturers to maintain the quality and reliability of the components, and ensure they are compatible with other devices and components.

MSLinfo
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Maximum Reflow Temperature (°C)info
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Reflow Solder Time (Sec)info
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Number of Reflow Cycleinfo
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Standardinfo
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Maximum Wave Temperature (°C)info
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Wave Solder Time (Sec)info
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Lead Finish(Plating)info
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Under Plating Materialinfo
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Terminal Base Materialinfo
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parametricParametric

The parametric information displays vital features and performance metrics of the component, which helps engineers and supply chain managers to compare and choose the most appropriate electronic component for their applications and needs.

Product Line
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Maximum High Level Output Voltage
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Minimum Low Level Output Voltage
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Maximum Low Level Output Voltage
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Typical Output Resistance
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Tradename
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Maximum Storage Temperature
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Minimum Storage Temperature
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Temperature Flag
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Operating Supply Voltage
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Maximum Power Dissipation
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Supplier Temperature Grade
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Process Technology
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Encryption Standard
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Maximum Supply Current
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Minimum High Level Output Voltage
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Family Name
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Data Bus Width
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Instruction Set Architecture
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Numeric and Arithmetic Format
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Core Architecture
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Device Core
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Program Memory Type
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Program Memory Size
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RAM Size
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Minimum Operating Supply Voltage
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Maximum Speed
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Maximum Operating Supply Voltage
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Number of ADCs
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ADC Channels
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ADC Resolution
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Number of DACs
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DAC Channels
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DAC Resolution
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Number of Programmable I/Os
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Interface Type
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I2C
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CAN
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UART
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Ethernet
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USART
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USB
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SPI
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I2S
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Device Million Instructions per Second
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Device Input Clock Speed
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Typical Operating Supply Voltage
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Minimum Operating Temperature
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Maximum Operating Temperature
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Programmability
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TMX320C6201BGJC31

TMX320C6201BGJC31By Texas Instruments