TMX320DM6446DZWTA

TMX320DM6446DZWTA

Texas Instruments
Grade Your BOM

Description:

DIGITAL MEDIA SYSTEM-ON-CHIP

Introduction date:

Dec 1, 2005

Updated: +90 days


See moreDigital Signal Processors - DSPs by Texas Instruments

Online version: https://www.datasheets.com/part-details/tmx320dm6446dzwta-texas-instruments-46312181

overviewOverview

Familiarize yourself with the fundamental general information, properties, and characteristics of the component, along with its compliance with industry standards and regulations.

LifeCycleinfo
EU RoHS
rohs unknownUnknown
RoHS Version
2011/65/EU
Automotive
noNo
Supplier Cage Codeinfo
01295
HTSUSAinfo
8542310001
Schedule Binfo
8542310000
PPAP
noNo
Category Path
Semiconductor > Microcontrollers and Processors > Processors > Digital Signal Processors - DSPs

pdfDatasheet

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packagePackage

The package information for the component gives important details about the product's size, weight, and packaging. This helps engineers determine if the product meets their requirements and expectations.

Basic Package Type
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Package Family Name
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Supplier Package
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Package Description
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Lead Shape
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Pin Count
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PCB
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Tabinfo
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Package Length (mm)info
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Package Width (mm)info
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Package Height (mm)info
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Seated Plane Height (mm)info
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Pin Pitch (mm)info
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Package Diameter (mm)
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Package Weight (g)
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Package Material
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Mounting
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Package Outline
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Package Overall Height (mm)
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Package Overall Width (mm)
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Package Overall Length (mm)
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manufacturingManufacturing

The manufacturing information specifies the technical requirements and specifications for producing and assembling the component. This information is crucial for manufacturers to maintain the quality and reliability of the components, and ensure they are compatible with other devices and components.

MSLinfo
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Maximum Reflow Temperature (°C)info
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Reflow Solder Time (Sec)info
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Maximum Wave Temperature (°C)info
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Wave Solder Time (Sec)info
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Lead Finish(Plating)info
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Under Plating Materialinfo
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Terminal Base Materialinfo
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parametricParametric

The parametric information displays vital features and performance metrics of the component, which helps engineers and supply chain managers to compare and choose the most appropriate electronic component for their applications and needs.

Product Line
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Minimum Storage Temperature
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Maximum Storage Temperature
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Temperature Flag
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Maximum Power Dissipation
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Supplier Temperature Grade
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Operating Supply Voltage
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Minimum High Level Output Voltage
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Maximum High Level Output Voltage
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Minimum Low Level Output Voltage
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Maximum Low Level Output Voltage
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Typical Output Resistance
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Tradename
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Encryption Standard
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Maximum Supply Current
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Process Technology
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Family Name
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Data Bus Width
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Instruction Set Architecture
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Numeric and Arithmetic Format
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Core Architecture
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Device Core
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Program Memory Type
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Program Memory Size
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Minimum Operating Supply Voltage
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RAM Size
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Maximum Speed
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Maximum Operating Supply Voltage
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Number of ADCs
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ADC Channels
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ADC Resolution
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Number of DACs
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DAC Channels
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DAC Resolution
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Number of Programmable I/Os
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Interface Type
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I2C
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CAN
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UART
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Ethernet
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USART
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USB
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SPI
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I2S
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Device Million Instructions per Second
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Device Input Clock Speed
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Typical Operating Supply Voltage
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Minimum Operating Temperature
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Maximum Operating Temperature
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Programmability
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