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TS256MLQ64V8U

Description:

DRAM Module DDR2 SDRAM 2Gbyte 240UDIMM

Country of Origin:

Taiwan

Introduction date:

Feb 19, 2013

Updated: 09-JUN-2023


See moreMemory Modules by Transcend Information

Online version: https://www.datasheets.com/part-details/ts256mlq64v8u-transcend-information-55733912

overviewOverview

Familiarize yourself with the fundamental general information, properties, and characteristics of the component, along with its compliance with industry standards and regulations.

LifeCycleinfo
EU RoHS
rohs yesYes
RoHS Version
2011/65/EU, 2015/863
ECCNinfo
EAR99
Automotive
rohs unknownUnknown
Supplier Cage Codeinfo
1FXG7
HTSUSAinfo
8473301140
Schedule Binfo
8473300002
Category Path
Semiconductor > Memory > Memory Cards and Modules > Memory Modules

pdfDatasheet

Get a comprehensive understanding of the electronic component by downloading its datasheet. This PDF document includes all the necessary details, such as product overview, features, specifications, ratings, diagrams, applications, and more.

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packagePackage

The package information for the component gives important details about the product's size, weight, and packaging. This helps engineers determine if the product meets their requirements and expectations.

Supplier Package
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Pin Count
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PCB
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Tabinfo
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Package Length (mm)info
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Package Width (mm)info
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Package Height (mm)info
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Package Diameter (mm)
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Mounting
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Package Outline
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manufacturingManufacturing

The manufacturing information specifies the technical requirements and specifications for producing and assembling the component. This information is crucial for manufacturers to maintain the quality and reliability of the components, and ensure they are compatible with other devices and components.

MSLinfo
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Maximum Reflow Temperature (°C)info
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Reflow Solder Time (Sec)info
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Maximum Wave Temperature (°C)info
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Wave Solder Time (Sec)info
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Lead Finish(Plating)info
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Under Plating Materialinfo
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Terminal Base Materialinfo
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parametricParametric

The parametric information displays vital features and performance metrics of the component, which helps engineers and supply chain managers to compare and choose the most appropriate electronic component for their applications and needs.

Product Line
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Warranty
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Maximum Refresh Cycle Time
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Process Technology
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Minimum Storage Temperature
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Refresh Cycles
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Self Refresh
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Module Sides
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PLL
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Number of Module Banks
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SPD EEPROM Support
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Number of Chip Banks
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PC Type
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Maximum Storage Temperature
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Total Density in Bits
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Supplier Temperature Grade
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Main Category
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Total Density
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Subcategory
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Maximum Clock Rate
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Maximum Access Time
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Organization
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Number of Chip per Module
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Chip Density
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Module Type
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Data Bus Width
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Chip Configuration
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ECC Support
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Number of Ranks
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Chip Package Type
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Typical Operating Supply Voltage
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Minimum Operating Supply Voltage
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Maximum Operating Supply Voltage
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Maximum Operating Current
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CAS Latency
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Minimum Operating Temperature
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Maximum Operating Temperature
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TS256MLQ64V8U

TS256MLQ64V8UBy Transcend Information