XC7Z035-1FBG676I

Description:	FPGA Zynq®-7000 Family 275000 Cells 28nm Technology 1V 676-Pin Lidless FCBGA
Manufacturer:	Advanced Micro Devices, Inc.
Country of Origin:	Taiwan
Introduction date:	Jul 28, 2016
Last Updated Date: +90
See moreField Programmable Gate Arrays - FPGAs by Advanced Micro Devices, Inc.

Online version: https://www.datasheets.com/part-details/xc7z035-1fbg676i-advanced-micro-devices--inc--62994678

Overview

Familiarize yourself with the fundamental general information, properties, and characteristics of the component, along with its compliance with industry standards and regulations.

LifeCycle

Premium

EU RoHS

Yes

RoHS Version

2011/65/EU, 2015/863

ECCN

3A991.d

Automotive

Yes

Supplier Cage Code

6Z9Z3

HTSUSA

8542390001

Schedule B

8542390000

Taxonomy Path
Semiconductor > Programmable Devices > Programmable Logic Devices > Field Programmable Gate Arrays - FPGAs

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Datasheet

Get a comprehensive understanding of the electronic component by downloading its datasheet. This PDF document includes all the necessary details, such as product overview, features, specifications, ratings, diagrams, applications, and more.

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Package

The package information for the component gives important details about the product's size, weight, and packaging. This helps engineers determine if the product meets their requirements and expectations.

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Basic Package Type

Package Family Name

Supplier Package

Package Description

Lead Shape

Pin Count

PCB

Tab

Package Length (mm)

Package Width (mm)

Package Height (mm)

Seated Plane Height (mm)

Pin Pitch (mm)

Package Diameter (mm)

Package Weight (g)

Package Material

Mounting

Package Outline

Package Overall Height (mm)

Package Overall Width (mm)

Package Overall Length (mm)

Manufacturing

The manufacturing information specifies the technical requirements and specifications for producing and assembling the component. This information is crucial for manufacturers to maintain the quality and reliability of the components, and ensure they are compatible with other devices and components.

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MSL

Maximum Reflow Temperature (°C)

Reflow Solder Time (Sec)

Number of Reflow Cycle

Reflow Temp. Source

Maximum Wave Temperature (°C)

Wave Solder Time (Sec)

Lead Finish(Plating)

Under Plating Material

Terminal Base Material

Parametric

The parametric information displays vital features and performance metrics of the component, which helps engineers and supply chain managers to compare and choose the most appropriate electronic component for their applications and needs.

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Product Line

Number of Inter Dielectric Layers

Maximum Storage Temperature

Minimum Storage Temperature

Maximum Differential I/O Pairs

Maximum I/O Performance

Maximum Distributed RAM Bits

Maximum DSP Block Frequency

Maximum MLAB Capacity

Device PCIe Hard IP Blocks

Number of Regional Clocks

Maximum LVDS Data Rate

Digital Control Impedance

Number of I/O Banks

Mega Multiply Accumulates per second

I/O Voltage

Shift Registers

Number of Global Clocks

In-System Programmability

Maximum Internal Frequency

Supplier Temperature Grade

Reprogrammability Support

Tolerant Configuration Interface Voltage

Temperature Flag

Typical Supply Current

Maximum Power Dissipation

Copy Protection

Device Logic Gates

Device Logic Units

Tradename

JTAG Support

Maximum Supply Current

Family Name

Maximum Number of User I/Os

Number of Registers

RAM Bits

Device Logic Cells

Number of Look-up Table Input

Device System Gates

Ethernet MACs

Minimum Operating Supply Voltage

Number of Multipliers

Typical Operating Supply Voltage

Processor Blocks

Transceiver Blocks

Maximum Operating Supply Voltage

Transceiver Speed

Program Memory Type

Dedicated DSP

PCI Blocks

Device Number of DLLs/PLLs

Total Number of Block RAM

Maximum Propagation Delay Time

Giga Multiply Accumulates per Second

Maximum Number of SERDES Channels

Speed Grade

Differential I/O Standards Supported

Single-Ended I/O Standards Supported

External Memory Interface

Supported IP Core

Supported IP Core Manufacture

Minimum Operating Temperature

Maximum Operating Temperature

Programmability

Process Technology

XC7Z035-1FBG676I

Manufacturer:Advanced Micro Devices, Inc.

Tools/Calculators

XC7Z035-1FBG676I

Description:

FPGA Zynq®-7000 Family 275000 Cells 28nm Technology 1V 676-Pin Lidless FCBGA

Manufacturer:

Advanced Micro Devices, Inc.

Country of Origin:

Taiwan

Introduction date:

Overview

Datasheet

Datasheet Preview

Package

Manufacturing

Parametric

XC7Z035-1FBG676I