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XIO2000AZZZ

Description:

PCI Bridge Chip 32bit 33MHz/66MHz 32bit 201-Pin BGA MICROSTAR Tray

Country of Origin:

Philippines

Introduction date:

Jan 1, 2006

Updated: +90 days


See morePCI Bridge Chip by Texas Instruments

Online version: https://www.datasheets.com/part-details/xio2000azzz-texas-instruments-21593373

overviewOverview

Familiarize yourself with the fundamental general information, properties, and characteristics of the component, along with its compliance with industry standards and regulations.

LifeCycleinfo
EU RoHS
rohs yesYes
RoHS Version
2011/65/EU, 2015/863
ECCNinfo
EAR99
Automotive
noNo
Supplier Cage Codeinfo
01295
HTSUSAinfo
8542390001
Schedule Binfo
8542390060
PPAP
noNo
AEC Qualified
noNo
Category Path
Semiconductor > Drivers and Interfaces > PCI > PCI Bridge Chip

pdfDatasheet

Get a comprehensive understanding of the electronic component by downloading its datasheet. This PDF document includes all the necessary details, such as product overview, features, specifications, ratings, diagrams, applications, and more.

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packagePackage

The package information for the component gives important details about the product's size, weight, and packaging. This helps engineers determine if the product meets their requirements and expectations.

Basic Package Type
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Package Family Name
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Supplier Package
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Package Description
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Lead Shape
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Pin Count
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PCB
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Tabinfo
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Package Length (mm)info
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Package Width (mm)info
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Package Height (mm)info
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Seated Plane Height (mm)info
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Pin Pitch (mm)info
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Package Diameter (mm)
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Package Weight (g)
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Package Material
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Mounting
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Package Outline
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Package Overall Height (mm)
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Package Orientation Marking Type
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Package Orientation
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Package Overall Width (mm)
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Package Overall Length (mm)
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Jedec
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manufacturingManufacturing

The manufacturing information specifies the technical requirements and specifications for producing and assembling the component. This information is crucial for manufacturers to maintain the quality and reliability of the components, and ensure they are compatible with other devices and components.

MSLinfo
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Maximum Reflow Temperature (°C)info
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Reflow Solder Time (Sec)info
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Number of Reflow Cycleinfo
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Standardinfo
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Reflow Temp. Source
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Maximum Wave Temperature (°C)info
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Wave Solder Time (Sec)info
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Lead Finish(Plating)info
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Under Plating Materialinfo
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Terminal Base Materialinfo
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parametricParametric

The parametric information displays vital features and performance metrics of the component, which helps engineers and supply chain managers to compare and choose the most appropriate electronic component for their applications and needs.

Product Line
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Minimum Storage Temperature
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Maximum Storage Temperature
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Temperature Flag
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Supplier Temperature Grade
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Maximum Power Dissipation
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Processor Interface Address Bus Width
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Processor Bus Frequency
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Interface Data Bus Width
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Process Technology
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PCI Frequency
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PCI Data Bus Width
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Bridge Type
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ECC Support
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GPIO
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Minimum Operating Supply Voltage
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Minimum Operating Temperature
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Maximum Operating Temperature
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Typical Operating Supply Voltage
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Maximum Operating Supply Voltage
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XIO2000AZZZ

XIO2000AZZZBy Texas Instruments