The HD74LS670P is a 4Kb parallel SRAM with a 4x4 organization and an access time of 45ns. It operates at a supply voltage of 5V and is packaged in a DIP16 package. The device is suitable for commercial extended temperature applications, with a maximum operating temperature of 75°C and a minimum operating temperature of -20°C. It is not qualified for use in high-reliability applications.
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Technical Specifications
Renesas HD74LS670P technical specifications.
General
| Access Time-Max | 45ns |
| Density | 16b |
| Height - Seated (Max) | 5.06mm |
| JESD-30 Code | R-PDIP-T16 |
| Length | 19.2mm |
| Logic IC Type | PARALLEL IN PARALLEL OUT |
| Max Operating Temperature | 75°C |
| Memory Type | SRAM, |
| Memory Width | 4 |
| Min Operating Temperature | -20°C |
| Number of Functions | 1 |
| Number of Words | 4 |
| Number of Words Code | 4 |
| Organization | 4X4 |
| Package Body Material | Plastic |
| Package Code | DIP |
| Package Equivalence Code | DIP16,.3 |
| Package Shape | Rectangular |
| Package Style | IN-LINEMeter |
| Parallel/Serial | PARALLEL |
| Power Supplies | 5V |
| Qualification Status | Not Qualified |
| Reach SVHC Compliant | Yes |
| Supply Voltage-Max (Vsup) | 5.25V |
| Supply Voltage-Min (Vsup) | 4.75V |
| Supply Voltage-Nom (Vsup) | 5V |
| Surface Mount | No |
| Technology | CMOS |
| Temperature Grade | COMMERCIAL EXTENDED |
| Terminal Form | Through Hole |
| Terminal Pitch | 2.54mm |
| Terminal Position | DUAL |
| Width | 7.62mm |
Compliance
| RoHS | Not Compliant |
Datasheet
Renesas HD74LS670P Datasheet
Download the complete datasheet for Renesas HD74LS670P to view detailed technical specifications.
No datasheet is available for this part.