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Technical Specifications
Renesas HM6AQB18202BPL50 technical specifications.
General
Access Time-Max
0.45ns
Density
37748736b
Height - Seated (Max)
1.46mm
JESD-30 Code
R-PBGA-B165
JESD-609 Code
e0
Length
17mm
Max Operating Temperature
70°C
Memory Type
QDR SRAM
Memory Width
18
Min Operating Temperature
0°C
Number of Functions
1
Number of Words
2097152
Number of Words Code
2M
Organization
2MX18
Package Body Material
Plastic
Package Code
LBGA
Package Shape
Rectangular
Package Style
GRID ARRAY, LOW PROFILEMeter
Parallel/Serial
PARALLEL
Peak Reflow Temperature (Cel)
240°C
Qualification Status
Not Qualified
Reach SVHC Compliant
Yes
RoHS Compliant
No
Supply Voltage-Max (Vsup)
1.9V
Supply Voltage-Min (Vsup)
1.7V
Supply Voltage-Nom (Vsup)
1.8V
Surface Mount
Yes
Technology
CMOS
Temperature Grade
COMMERCIAL
Terminal Finish
Tin
Terminal Form
Ball
Terminal Pitch
1mm
Terminal Position
BOTTOM
Width
15mm
Compliance
RoHS
Not Compliant
Datasheet
Renesas HM6AQB18202BPL50 Datasheet
Download the complete datasheet for Renesas HM6AQB18202BPL50 to view detailed technical specifications.
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