Quick Jump:
Technical Specifications
Renesas HN58X2432TIE technical specifications.
General
| Clock Frequency-Max (fCLK) | 400kHz |
| Data Retention Time-Min | 10 |
| Density | 32768b |
| Endurance | 100000Cycles |
| Height - Seated (Max) | 1.1mm |
| I2C Control Byte | 1010DDDR |
| JESD-30 Code | R-PDSO-G8 |
| JESD-609 Code | e2 |
| Length | 4.4mm |
| Max Operating Temperature | 85°C |
| Max Supply Current | 3mA |
| Memory Type | EEPROM, |
| Memory Width | 8 |
| Min Operating Temperature | -40°C |
| Moisture Sensitivity Level | 1 |
| Number of Functions | 1 |
| Number of Words | 4096 |
| Number of Words Code | 4K |
| Organization | 4KX8 |
| Package Body Material | Plastic |
| Package Code | TSSOP |
| Package Equivalence Code | TSSOP8,.25 |
| Package Shape | Rectangular |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCHMeter |
| Parallel/Serial | SERIAL |
| Peak Reflow Temperature (Cel) | 260°C |
| Power Supplies | 2.5V |
| Qualification Status | Not Qualified |
| RoHS Compliant | Yes |
| Serial Bus Type | I2C |
| Standby Current-Max | 3uA |
| Supply Voltage-Max (Vsup) | 5.5V |
| Supply Voltage-Min (Vsup) | 1.8V |
| Supply Voltage-Nom (Vsup) | 2.5V |
| Surface Mount | Yes |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | Copper |
| Terminal Form | Gull Wing |
| Terminal Pitch | 0.65mm |
| Terminal Position | DUAL |
| Time @ Peak Reflow Temperature-Max (s) | 20s |
| Width | 3mm |
| Write Cycle Time-Max (tWC) | 15ms |
| Write Protection | HARDWARE |
Compliance
| RoHS | Compliant |
Datasheet
Renesas HN58X2432TIE Datasheet
Download the complete datasheet for Renesas HN58X2432TIE to view detailed technical specifications.
No datasheet is available for this part.