Renesas
HN58X2564TIE
Serial Peripheral Interface Electrically Erasable and Programmable Read Only Memory
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Technical Specifications
Renesas HN58X2564TIE technical specifications.
General
| Clock Frequency-Max (fCLK) | 3MHz |
| Data Retention Time-Min | 10 |
| Density | 65536b |
| Endurance | 100000Cycles |
| Height - Seated (Max) | 1.1mm |
| JESD-30 Code | R-PDSO-G8 |
| JESD-609 Code | e4 |
| Length | 4.4mm |
| Max Operating Temperature | 85°C |
| Max Supply Current | 3.5mA |
| Memory Type | EEPROM, |
| Memory Width | 8 |
| Min Operating Temperature | -40°C |
| Moisture Sensitivity Level | 1 |
| Number of Functions | 1 |
| Number of Words | 8192 |
| Number of Words Code | 8K |
| Organization | 8KX8 |
| Package Body Material | Plastic |
| Package Code | TSSOP |
| Package Equivalence Code | TSSOP8,.25 |
| Package Shape | Rectangular |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCHMeter |
| Parallel/Serial | SERIAL |
| Peak Reflow Temperature (Cel) | 260°C |
| Power Supplies | 2.5V |
| Qualification Status | Not Qualified |
| RoHS Compliant | Yes |
| Serial Bus Type | SPI |
| Standby Current-Max | 3uA |
| Supply Voltage-Max (Vsup) | 5.5V |
| Supply Voltage-Min (Vsup) | 1.8V |
| Supply Voltage-Nom (Vsup) | 2.5V |
| Surface Mount | Yes |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | Nickel |
| Terminal Form | Gull Wing |
| Terminal Pitch | 0.65mm |
| Terminal Position | DUAL |
| Time @ Peak Reflow Temperature-Max (s) | 20s |
| Width | 3mm |
| Write Cycle Time-Max (tWC) | 8ms |
| Write Protection | HARDWARE/SOFTWARE |
Compliance
| RoHS | Compliant |
Datasheet
Renesas HN58X2564TIE Datasheet
Download the complete datasheet for Renesas HN58X2564TIE to view detailed technical specifications.
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