PackageSOIC
Power3mW
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Technical Specifications
Rochester Electronics ADG508FBNZ technical specifications.
General
| Package/Case | SOIC |
| Drain to Source Resistance | 300R |
| Lead Free | Contains Lead |
| Nominal Supply Current | 600uA |
| Number of Channels | 8 |
| Number of Circuits | 1 |
| Packaging | Bulk |
| Power Dissipation | 3mW |
| Reach SVHC Compliant | Yes |
| RoHS Compliant | Yes |
| Throw Configuration | DPST |
Compliance
| RoHS | Compliant |
Datasheet
Rochester Electronics ADG508FBNZ Datasheet
Download the complete datasheet for Rochester Electronics ADG508FBNZ to view detailed technical specifications.
No datasheet is available for this part.