This 8-position through-hole header features gold contact plating and a 2.54mm pitch. It is designed for board-to-board and mezzanine connections. The header is available in bulk packaging and is compliant with RoHS regulations. It is not radiation hardened and has a single row of 8 contacts. The header is suitable for through-hole mounting.
MountingThrough Hole
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Technical Specifications
Samtec DW-08-13-L-S-827 technical specifications.
General
| Contact Plating | Gold |
| Gender | Male |
| Mount | Through Hole |
| Number of Contacts | 8 |
| Number of Rows | 1 |
| Packaging | Bulk |
| Pitch | 2.54mm |
| Radiation Hardening | No |
| RoHS Compliant | Yes |
| Termination | Solder |
Compliance
| RoHS | Compliant |
Datasheet
Samtec DW-08-13-L-S-827 Datasheet
Download the complete datasheet for Samtec DW-08-13-L-S-827 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.