MLC NAND Flash memory with 2G-bit density, featuring a 3.3V operating voltage and 33ns maximum access time. This surface-mount component utilizes a 69-pin Fine Pitch Ball Grid Array (FBGA) package with a 0.8mm pin pitch. It offers symmetrical block organization and sectored architecture, with a 16-bit address bus width. Operating across a temperature range of -40°C to 85°C, it has a maximum operating current of 45mA.
PackageFBGA
MountingSurface Mount
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Technical Specifications
Sandisk MD8331-d2G-V3-X-P technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FBGA
Package Description
Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
69
PCB
69
Package Length (mm)
12
Package Width (mm)
9
Package Height (mm)
0.94
Seated Plane Height (mm)
1.2
Pin Pitch (mm)
0.8
Package Material
Plastic
Mounting
Surface Mount
Density
2Gbit
Maximum Operating Current
45mA
Block Organization
Symmetrical
Architecture
Sectored
Timing Type
Asynchronous
Maximum Access Time
33(Typ)ns
Boot Block
Yes
Typical Operating Supply Voltage
3.3V
Address Bus Width
16bit
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
03LB0
EU RoHS
Yes
HTS Code
8542320071
Schedule B
8542320070
ECCN
3A991.b.1.a
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU
Datasheet
Sandisk MD8331-d2G-V3-X-P Datasheet
Download the complete datasheet for Sandisk MD8331-d2G-V3-X-P to view detailed technical specifications.
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