MLC NAND Flash memory with 2G-bit density, featuring a 3.3V operating voltage and 33ns maximum access time. This surface-mount component utilizes a 69-pin Fine Pitch Ball Grid Array (FBGA) package with a 0.8mm pin pitch. It offers symmetrical block organization and sectored architecture, with a 16-bit address bus width. Operating across a temperature range of -40°C to 85°C, it has a maximum operating current of 45mA.
PackageFBGA
MountingSurface Mount
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Technical Specifications
Sandisk MD8331-d2G-V3-X-P technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FBGA |
| Package Description | Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 69 |
| PCB | 69 |
| Package Length (mm) | 12 |
| Package Width (mm) | 9 |
| Package Height (mm) | 0.94 |
| Seated Plane Height (mm) | 1.2 |
| Pin Pitch (mm) | 0.8 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Density | 2Gbit |
| Maximum Operating Current | 45mA |
| Block Organization | Symmetrical |
| Architecture | Sectored |
| Timing Type | Asynchronous |
| Maximum Access Time | 33(Typ)ns |
| Boot Block | Yes |
| Typical Operating Supply Voltage | 3.3V |
| Address Bus Width | 16bit |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | 03LB0 |
| EU RoHS | Yes |
| HTS Code | 8542320071 |
| Schedule B | 8542320070 |
| ECCN | 3A991.b.1.a |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU |
Datasheet
Sandisk MD8331-d2G-V3-X-P Datasheet
Download the complete datasheet for Sandisk MD8331-d2G-V3-X-P to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.