Search Results for &quot; 4816P-1-561LF &quot;

Resistor Networks & Arrays 82ohm 2% 16Pin SMT

Obsolete

Package/Case: SOIC

Circuit Type: Bussed

Contact Plating: Tin, Lead

Lead Pitch: 1.27mm

4816P-1-474

Resistor Networks & Arrays 470K 2% 16Pin SMT ISOLATED

Obsolete

Package/Case: SOIC

Circuit Type: Isolated

Contact Plating: Tin, Lead

Lead Pitch: 1.27mm

4816P-1-222

Resistor Networks & Arrays 2.2K 2% 16Pin SMT ISOLATED

Not Recommended for New Design

Package/Case: SOIC

Circuit Type: Isolated

Lead Pitch: 1.27mm

Max Operating Temperature: 125°C

+12

4816P-2-221

Resistor Networks & Arrays 22ohm 2% 16Pin SMT

Not Recommended for New Design

Package/Case: SOIC

Circuit Type: Bussed

Lead Pitch: 1.27mm

Max Operating Temperature: 125°C

+12

4816P-1-211

RES ARRAY 8 RES 210 OHM 16SOIC

Not Recommended for New Design

Package/Case: SOIC

Circuit Type: Isolated

Height: 0.085inch

Length: 0.44inch

+11

4816P-2-183

Resistor Networks & Arrays 18K 2% 16Pin SMT

Obsolete

Package/Case: SOIC

Circuit Type: Bussed

Lead Pitch: 1.27mm

Max Operating Temperature: 125°C

4816P-1-124

Resistor Networks & Arrays 120K 2% 16Pin SMT ISOLATED

Obsolete

Package/Case: SOIC

Circuit Type: Isolated

Lead Pitch: 1.27mm

Max Operating Temperature: 125°C

4116R-1-561LF

560R 16 Elements Isolated Thick Film Resistor Network DIP 16 Pin

Volume Production

Package/Case: DIP

Circuit Type: Isolated

Depth: 7.87mm

Height: 0.185inch

+26

4816P-1-183

Res Thick Film NET 18K Ohm 2% 1.28W ±100ppm/C ISOL Molded 16-Pin SOM Gull Wing SMD T/R

Not Recommended for New Design

Package/Case: SOIC

Circuit Type: Isolated

Depth: 7.62mm

Lead Pitch: 1.27mm

+19

4816P-1-150

RES ARRAY 8 RES 15 OHM 16SOIC

Obsolete

Package/Case: SOIC

Circuit Type: Isolated

Contact Plating: Tin, Lead

Depth: 7.62mm

+19

4816P-1-180

RES ARRAY 8 RES 18 OHM 16SOIC

Not Recommended for New Design

Package/Case: SOIC

Circuit Type: Isolated

Depth: 7.62mm

Height: 0.085inch

+18

4816P-2-225

Resistor Networks & Arrays 2.2M 2% 16Pin SMT

Obsolete

Package/Case: SOIC

Circuit Type: Bussed

Depth: 7.62mm

Height: 0.085inch

+18

4816P-1-301

RES ARRAY 8 RES 300 OHM 16SOIC

Obsolete

Package/Case: SOIC

Circuit Type: Isolated

Depth: 7.62mm

Height: 0.085inch

+17

4816P-1-203

Res Thick Film NET 20K Ohm 2% 1.28W ±100ppm/C ISOL Molded 16-Pin SOM Gull Wing SMD T/R

Not Recommended for New Design

Package/Case: Molded

Circuit Type: Isolated

Contact Plating: Tin, Lead

Depth: 7.62mm

+17

4816P-2-471

Resistor Networks & Arrays 47ohm 2% 16Pin SMT

Not Recommended for New Design

Package/Case: SOIC

Circuit Type: Bussed

Contact Plating: Tin, Lead

Lead Pitch: 1.27mm

+14

4816P-2-272

Resistor Networks & Arrays 2.7K 2% 16Pin SMT

Not Recommended for New Design

Package/Case: SOIC

Circuit Type: Bussed

Contact Plating: Tin, Lead

Lead Pitch: 1.27mm

+14

4816P-2-511

Resistor Networks & Arrays 51ohm 2% 16Pin SMT

Obsolete

Package/Case: SOIC

Circuit Type: Bussed

Height: 0.085inch

Lead Pitch: 1.27mm

4816P-1-122

Resistor Networks & Arrays 1.2K 2% 16Pin SMT ISOLATED

Obsolete

Package/Case: SOIC

Circuit Type: Isolated

Contact Plating: Tin, Lead

Lead Pitch: 1.27mm

4816P-1-622

RES ARRAY 8 RES 6.2K OHM 16SOIC

Obsolete

Package/Case: SOIC

Circuit Type: Isolated

Height: 0.085inch

Lead Pitch: 1.27mm

4816P-1-683

Resistor Networks & Arrays 68K 2% 16Pin SMT ISOLATED

Not Recommended for New Design

Package/Case: SOIC

Circuit Type: Isolated

Contact Plating: Tin, Lead

Lead Pitch: 1.27mm