Search Results for &quot; 70V3599S133BFI &quot;

SRAM Chip Sync Dual 3.3V 4.5M-Bit 128K x 36 15ns/4.2ns 208-Pin CABGA

Volume Production

Access Time: 25ns

Address Bus Width: 34b

Package/Case: LFBGA

Density: 4.5Mb

CABGA-208, Tray

LFBGA, BGA208,17X17,32

Transferred

Max Operating Temperature: 85

Number of Terminals: 208

Min Operating Temperature: -40

Terminal Position: BOTTOM

SRAM Chip Sync Dual 3.3V 4.5M-Bit 128K x 36 15ns/4.2ns 208-Pin CABGA T/R

Volume Production

Access Time: 15ns

Address Bus Width: 34b

Package/Case: LFBGA

Density: 4.5Mb

CABGA-208, Reel

LFBGA, BGA208,17X17,32

Transferred

Max Operating Temperature: 85

Number of Terminals: 208

Min Operating Temperature: -40

Terminal Position: BOTTOM

Search Results for "70V3599S133BFI"

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SRAM Chip Sync Dual 3.3V 4.5M-Bit 128K x 36 15ns/4.2ns 208-Pin CABGA

Volume Production

Access Time: 25ns

Address Bus Width: 34b

Package/Case: LFBGA

Density: 4.5Mb

CABGA-208, Tray

LFBGA, BGA208,17X17,32

Transferred

Max Operating Temperature: 85

Number of Terminals: 208

Min Operating Temperature: -40

Terminal Position: BOTTOM

SRAM Chip Sync Dual 3.3V 4.5M-Bit 128K x 36 15ns/4.2ns 208-Pin CABGA T/R

Volume Production

Access Time: 15ns

Address Bus Width: 34b

Package/Case: LFBGA

Density: 4.5Mb

CABGA-208, Reel