Search Results for "C1-5508-5"

14-bit 80Msps Pipelined ADC, 1-Ch, Parallel/LVDS, HVQFN

32-Bit ARM MCU, 50MHz, 256KB Flash, 32KB RAM, LQFP

maxiFLOW BGA Heat Sink, 42.5mm x 12.5mm, 2.4°C/W Thermal Resistance

24-Pin SO Speech Network IC, 15.5dB Tx Gain, 6.5dB Rx Gain

14-bit 65Msps Pipelined ADC, 1-Ch, Parallel/LVDS, HVQFN EP

Audio IC: Speech Network, 45.2dB Tx Gain, 16-Pin SOIC, SMT

32-Bit ARM MCU, 80MHz, 256KB Flash, LQFP-100

12-Position SP12T Rotary Switch, 28V, 250mA, Through Hole/Panel Mount

BGA Package Heat Sink, 30mm x 30mm x 17.5mm, Anodized Aluminium, Clip Mount

Nylon Cable Tie, 99mm Length, 1.1mm Thickness, -40°C to 85°C

maxiFLOW BGA Heat Sink, 35mm x 35mm x 7.5mm, Adhesive Mount

maxiFLOW BGA Heat Sink, 32.5mm x 1.28inch, 7.5mm Height, Adhesive Mount

maxiGRIP, maxiFLOW Heat Sink, BGA Package, 4.8°C/W Thermal Resistance

maxiGRIP maxiFLOW BGA Heat Sink, 25mm x 25mm x 17.5mm, Anodized Aluminium

maxiFLOW BGA Heat Sink, 4.5°C/W Thermal Resistance, 100 LFM

Heat Sink Passive Spread Clip 2.42°C/W Black Anodized

Heat Sink Passive BGA Spread Clip 7.13C/W Black Anodized

Heat Sink Passive BGA Spread Clip 11.86C/W Black Anodized

maxiFLOW BGA Adhesive Heat Sink, 5.4°C/W Thermal Resistance

maxiFLOW Heat Sink, 38mm x 38mm x 25mm, Anodized Aluminium, Push Pin Mount