
PROTOTYPE BOARD MODULE; Development Tool Type: Prototype Module; Kit Features: 29
E-BLOCKS, ECIO, WITH ISCP, APPLICATION BOARD; Silicon Manufacturer:Matrix; Silicon Core Number:-; Kit Application Type:Interface; Application Sub Type:ICSP Interface; Kit Contents:Application Board ;RoHS Compliant: Yes

Heat-shrink tubing 3:1 in blister bag Polyolefin, cross-linked (POX) 3:1 -55. . .+135 °C, HIS-3-BAG-1,5/0,5-BK, HellermannTyton

Heat-shrink tubing 3:1 in blister bag Polyolefin, cross-linked (POX) 3:1 -55. . .+135 °C - 308-30315, HIS-3-BAG-3/1-CL, HellermannTyton