10-Bit 210MSPS Parallel DAC, 1-Ch, Bipolar Output, TSSOP
10-Bit 210MSPS ADC, Differential Input, Parallel Interface
12-Bit 210MSPS DAC, Parallel Interface, SOIC
10-Bit 210MSPS DAC, Parallel Interface, SOIC
12-Bit 210MSPS DAC, Parallel Interface, LFCSP EP
64 Pos 2 Row RA Header, Male Pin, Tin, 2.54mm Pitch
64 Pos 2 Row 2.54mm Pitch Male Pin Header, Through Hole, Tin
N-Channel MOSFET, 250V, 27A, 110mR, TO-3P
Time Delay Fuse, 1.6A, 125VAC, Radial, Through Hole
IR LED Emitter 950nm 100mA 140mW/sr 44° Viewing Angle
210 Pos 2.54mm Straight Header, Gold Contact, TH
210 Pos RA Solder Thru-Hole Backplane Connector, 2.54mm Pitch
210 Pos High Speed Backplane Conn, 10Gbps, Press-Fit, RA, Thru-Hole
210 Pos Backplane Conn, 1.9mm Pitch, Press-Fit, 10Gbps, 250V
3 Row 210 Pos Male Header, 2.54mm Pitch, Through Hole
210 Pos Receptacle, Right Angle, 2.54mm Pitch, Gold/Tin
20 Pos 2mm Socket Header, Vertical, Thru-Hole, Gold/Tin
DIP32 IC Socket, 32 Pos, Gold Plated, Through Hole, 3A, 1kV
8-Pos DIP Socket, Gold Plated, 2.54mm Pitch, 3A
8 Pos 2.54mm Straight Header, Gold Plated Brass Pins, 3A, 200V
