2Gbyte DDR3 SDRAM Registered Dual In-Line Memory Module (RDIMM) operating at 1333 MHz. Features a 240-pin configuration with a 72-bit data bus width and 9 chips per module, organized as 256Mx72. Supports ECC with a CAS Latency of 9 and a maximum access time of 20 ns. Utilizes a non-lead-frame SMT package with a 1 mm pin pitch, designed for socket mounting. Operates with a typical supply voltage of 1.5 V and a temperature range of 0 °C to 85 °C.
PackageRDIMM
MountingSocket
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Technical Specifications
SK Hynix HMT325R7BFR8C-H9 technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
DIM
Package/Case
RDIMM
Package Description
Registered Dual In Line Memory Module
Lead Shape
No Lead
Pin Count
240
PCB
240
Package Length (mm)
133.35
Package Width (mm)
3.43(Max)
Package Height (mm)
30
Pin Pitch (mm)
1
Mounting
Socket
Main Category
DRAM Module
Total Density
2Gbyte
Module Type
240RDIMM
Maximum Access Time
20ns
Maximum Clock Rate
1333MHz
Chip Density
2Gbit
Subcategory
DDR3 SDRAM
Data Bus Width
72bit
Number of Chip per Module
9
Organization
256Mx72
Typical Operating Supply Voltage
1.5V
Maximum Operating Current
1619mA
Min Operating Supply Voltage
1.425V
Max Operating Supply Voltage
1.575V
Min Operating Temperature
0°C
Max Operating Temperature
85°C
Chip Configuration
256Mx8
ECC Support
Yes
Number of Ranks
Single
CAS Latency
9
Compliance
Cage Code
9162F
EU RoHS
Yes
HTS Code
8473301140
Schedule B
8473300002
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
SK Hynix HMT325R7BFR8C-H9 Datasheet
Download the complete datasheet for SK Hynix HMT325R7BFR8C-H9 to view detailed technical specifications.
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