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Technical Specifications
Spansion S25FL164K0XMFI013 technical specifications.
General
| Package/Case | SOIC |
| Density | 64Mb |
| Interface | SPI, Serial |
| Lead Free | Lead Free |
| Max Operating Temperature | 85°C |
| Memory Type | NOR, |
| Min Operating Temperature | -40°C |
| Packaging | Tape and Reel |
| Page Size | 256B |
| Radiation Hardening | No |
| RoHS Compliant | Yes |
Compliance
| RoHS | Compliant |
Datasheet
Spansion S25FL164K0XMFI013 Datasheet
Download the complete datasheet for Spansion S25FL164K0XMFI013 to view detailed technical specifications.
No datasheet is available for this part.