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Technical Specifications
Spansion S34ML01G200BHI900 technical specifications.
General
| Address Bus Width | 28b |
| Package/Case | BGA |
| Density | 1Gb |
| Interface | Parallel |
| Max Operating Temperature | 85°C |
| Memory Type | SLC NAND, |
| Min Operating Temperature | -40°C |
| Packaging | Tray |
| Page Size | 2KB |
| Radiation Hardening | No |
| RoHS Compliant | No |
Compliance
| RoHS | Not CompliantNo |
Datasheet
Spansion S34ML01G200BHI900 Datasheet
Download the complete datasheet for Spansion S34ML01G200BHI900 to view detailed technical specifications.
No datasheet is available for this part.