PackageSIP
MountingThrough Hole
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Technical Specifications
Taiwan Semiconductor GBU1007C2 technical specifications.
General
Package/Case
SIP
Forward Current
10A
Max Operating Temperature
150°C
Min Operating Temperature
-55°C
Max Repetitive Reverse Voltage (Vrrm)
1kV
Mount
Through Hole
Number of Elements
1
Packaging
Rail/Tube
Peak Non-Repetitive Surge Current
220A
Radiation Hardening
No
RoHS Compliant
Yes
Compliance
RoHS
Compliant
Datasheet
Taiwan Semiconductor GBU1007C2 Datasheet
Download the complete datasheet for Taiwan Semiconductor GBU1007C2 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.