PackageSIP
MountingThrough Hole
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Technical Specifications
Taiwan Semiconductor GBU602C2 technical specifications.
General
| Package/Case | SIP |
| Forward Current | 6A |
| Max Operating Temperature | 150°C |
| Min Operating Temperature | -55°C |
| Max Repetitive Reverse Voltage (Vrrm) | 100V |
| Mount | Through Hole |
| Number of Elements | 1 |
| Packaging | Rail/Tube |
| Peak Non-Repetitive Surge Current | 175A |
| RoHS Compliant | Yes |
Compliance
| RoHS | Compliant |
Datasheet
Taiwan Semiconductor GBU602C2 Datasheet
Download the complete datasheet for Taiwan Semiconductor GBU602C2 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.