PackageSIP
MountingThrough Hole
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Technical Specifications
Taiwan Semiconductor GBU605C2 technical specifications.
General
Package/Case
SIP
Forward Current
6A
Max Operating Temperature
150°C
Min Operating Temperature
-55°C
Max Repetitive Reverse Voltage (Vrrm)
600V
Mount
Through Hole
Number of Elements
1
Packaging
Rail/Tube
Peak Non-Repetitive Surge Current
175A
RoHS Compliant
Yes
Compliance
RoHS
Compliant
Datasheet
Taiwan Semiconductor GBU605C2 Datasheet
Download the complete datasheet for Taiwan Semiconductor GBU605C2 to view detailed technical specifications.
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