240-position, 2-row vertical header and receptacle for board-to-board applications, supporting DDR3 SDRAM and SDRAM memory types. Features a 0.039-inch pitch with 0.075-inch row spacing, copper alloy contacts with gold, tin, and matte plating, and a 750mA contact current rating. Through-hole mounting with solder termination and PCB mount retention. Operates within a -55°C to 155°C temperature range, with a UL94 V-0 flammability rating.
TE Connectivity 1-1932000-7 technical specifications.
| Circuit Application | Signal |
| Connector System | Board-to-Board |
| Contact Current Rating | 750mA |
| Contact Material | Copper Alloy |
| Contact Plating | Gold, Tin, Matte |
| Contact Post Length | 3.18mm |
| ELV | Compliant |
| Flammability Rating | UL94 V-0 |
| Housing Color | Black |
| Max Operating Temperature | 155°C |
| Memory Type | SDRAM, DDR3 SDRAM, |
| Min Operating Temperature | -55°C |
| Mount | Through Hole |
| Number of Contacts | 240 |
| Number of Positions | 240 |
| Number of Rows | 2 |
| Orientation | Straight |
| Package Quantity | 50 |
| Packaging | Tray |
| PCB Mount Retention | With |
| Pitch | 0.039inch |
| Radiation Hardening | No |
| RoHS Compliant | Yes |
| Row Spacing | 0.075inch |
| Sealable | No (Without) |
| Termination | Solder |
| RoHS | Compliant |
Download the complete datasheet for TE Connectivity 1-1932000-7 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.