4-position, single-row board-to-board header with a 2.54mm pitch. Features right-angle, through-hole mounting with a tin-plated copper-tin contact material and nickel underplate. Housing is black, with a 0.535-inch height and 0.13-inch contact post length. Includes PCB mount retention.
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Technical Specifications
TE Connectivity 1355253-4 technical specifications.
General
| Board Standoff | No (Without) |
| Contact Material | CuSn |
| Contact Mating Length | 0.319inch |
| Contact Plating | Tin |
| Contact Post Length | 0.13inch |
| Contact Protection | No (Without) |
| Contact Shape | Square |
| ELV | Compliant |
| Gasket | No (Without) |
| Height | 0.535inch |
| High Speed Serial Data Connector | No |
| High Temperature Compatible | No |
| High Temperature Housing | No |
| Housing Color | Black |
| Keyed | No |
| Mating Alignment | No (Without) |
| Mating Connector Lock | No (Without) |
| Number of Positions | 4 |
| Number of Rows | 1 |
| Orientation | Right Angle |
| Package Quantity | 300 |
| Packaging | Box |
| PCB Mount Retention | With |
| PCB Mounting Orientation | Right Angle |
| Pitch | 2.54mm |
| Plating Thickness | 2um |
| Sealable | No (Without) |
| Selectively Loaded | No (Without) |
| Series | AMPMODU MOD II |
| Stabilizers | No (Without) |
| Strain Relief | No (Without) |
| Termination | Press-Fit |
| Underplate Material | Nickel |
Compliance
| RoHS | Compliant |
Datasheet
TE Connectivity 1355253-4 Datasheet
Download the complete datasheet for TE Connectivity 1355253-4 to view detailed technical specifications.
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