TE Connectivity
1473149-1
200 Pos 2 Row Gold Plated Copper Alloy Header, 5.2mm Stack, 0.024" Pitch, SMT
200-position, 2-row straight header for cable-to-board applications, supporting DDR SDRAM memory. Features a 0.024-inch pitch and 0.244-inch row spacing, with a 5.2mm stack height. Rated for 500mA contact current and 25V AC, utilizing gold-plated copper alloy contacts. Constructed with a black thermoplastic housing, this surface mount component operates from -67°C to 185°C and meets UL94 V-0 flammability standards.
MountingSurface Mount
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Technical Specifications
TE Connectivity 1473149-1 technical specifications.
General
| Circuit Application | Power |
| Connector System | Cable-to-Board |
| Contact Current Rating | 500mA |
| Contact Material | Copper Alloy |
| Contact Plating | Gold |
| Depth | 26.5mm |
| ELV | Compliant |
| Flammability Rating | UL94 V-0 |
| Housing Color | Black |
| Insulation Material | Thermoplastic |
| Length | 71.1mm |
| Max Operating Temperature | 185°C |
| Memory Type | DDR SDRAM, |
| Min Operating Temperature | -67°C |
| Mount | Surface Mount |
| Number of Contacts | 200 |
| Number of Positions | 200 |
| Number of Rows | 2 |
| Orientation | Straight |
| Package Quantity | 20 |
| Packaging | Tray |
| PCB Mount Retention | With |
| Pitch | 0.024inch |
| RoHS Compliant | Yes |
| Row Spacing | 0.244inch |
| Sealable | No (Without) |
| Stack Height | 5.2mm |
| Termination | Solder |
| Voltage Rating (AC) | 25V |
Compliance
| RoHS | Compliant |
Datasheet
TE Connectivity 1473149-1 Datasheet
Download the complete datasheet for TE Connectivity 1473149-1 to view detailed technical specifications.
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