EMI/Dust Cover for XFP and QSFP connectors, constructed from durable zinc alloy. Designed for assembly applications, this cover supports data rates up to 10Gbps. Features include a length of 18.35mm and a depth of 22.25mm. The product is RoHS compliant. Supplied in cartons of 450 units.
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Technical Specifications
TE Connectivity 1888810-2 technical specifications.
General
| Body Material | ZINC ALLOY |
| Data Rate | 10Gbps |
| Depth | 22.25mm |
| ELV | Compliant |
| Lead Free | Not Applicable |
| Length | 18.35mm |
| Package Quantity | 450 |
| Packaging | Carton |
| Radiation Hardening | No |
| Reach SVHC Compliant | No |
| RoHS Compliant | Yes |
Compliance
| RoHS | Compliant |
Datasheet
TE Connectivity 1888810-2 Datasheet
Download the complete datasheet for TE Connectivity 1888810-2 to view detailed technical specifications.
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