
204-position, right-angle, surface-mount socket for DDR3 SDRAM and SDRAM memory modules. Features a 0.6mm pitch and copper alloy contacts with gold plating, rated for 500mA current. Designed for cable-to-board applications with a 5.2mm stack height and UL94 V-0 flammability rating. Operates within a temperature range of -67°C to 185°C, with lead-free and RoHS compliance. Packaged in tape and reel for automated assembly.
TE Connectivity 2-2013289-3 technical specifications.
| Circuit Application | Power |
| Connector System | Cable-to-Board |
| Contact Current Rating | 500mA |
| Contact Material | Copper Alloy |
| Contact Plating | Gold |
| ELV | Compliant |
| Flammability Rating | UL94 V-0 |
| Housing Color | Black |
| Lead Free | Lead Free |
| Max Operating Temperature | 185°C |
| Memory Type | SDRAM, DDR3 SDRAM, |
| Min Operating Temperature | -67°C |
| Mount | Surface Mount |
| Number of Contacts | 204 |
| Number of Positions | 204 |
| Number of Rows | 2 |
| Orientation | Right Angle |
| Package Quantity | 200 |
| Packaging | Tape and Reel |
| PCB Mount Retention | With |
| Pitch | 0.024inch |
| Radiation Hardening | No |
| RoHS Compliant | Yes |
| Row Spacing | 0.322inch |
| Sealable | No (Without) |
| Stack Height | 5.2mm |
| Termination | Solder |
| RoHS | Compliant |
Download the complete datasheet for TE Connectivity 2-2013289-3 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
