
Right-angle board-to-board receptacle with 192 positions and 16 columns, featuring a 0.075-inch pitch and 1.35mm row spacing. Designed for differential signaling with 4 differential pairs per column, supporting data rates up to 25Gbps and a 100-ohm impedance. Contacts are copper alloy with gold and tin plating, rated for 750mA current and 30V DC. Through-hole and edge mounting with press-fit termination, a 17.3mm stack height, and a black housing.
TE Connectivity 2007723-1 technical specifications.
Download the complete datasheet for TE Connectivity 2007723-1 to view detailed technical specifications.
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