Board-to-board header with 90 positions, 10 columns, and 9 rows, featuring a 0.075-inch pitch and 1.35mm row spacing. This male, straight, through-hole component supports differential signaling with 30 pairs and 3 differential pairs per column, achieving a 25Gbps data rate. It boasts a 750mA contact current rating with gold plating over nickel underplate and a copper alloy contact material. The black, fully shrouded housing offers UL94 V-0 flammability and a 185°C maximum operating temperature.
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Technical Specifications
TE Connectivity 2007790-1 technical specifications.
General
Color
Black
Connector System
Board-to-Board
Contact Current Rating
750mA
Contact Material
Copper Alloy
Contact Plating
Gold, Tin, Matte
Contact Style
Press-Fit
Data Rate
25Gbps
Differential Pairs per Column
3
Differential Signaling
Yes
ELV
Compliant
Flammability Rating
UL94 V-0
Gender
Male
Guide Hardware
No (Without)
Height
11.95mm
Housing Color
Black
Impedance
100R
Length
0.854inch
Make First / Break Last
No
Mating Alignment
Yes (With)
Mating Retention
No (Without)
Max Operating Temperature
185°C
Min Operating Temperature
-67°C
Mount
Through Hole
Number of Columns
10
Number of Contacts
90
Number of Ground Positions
30
Number of Pairs
30
Number of Positions
90
Number of Rows
9
Number of Signal Positions
60
Orientation
Straight
Package Quantity
23
Packaging
Rail/Tube
PCB Mount Retention
With
PCB Mounting Orientation
Vertical
PCB Thickness
1mm
Pitch
0.075inch
Plating Thickness
0.76um
Reach SVHC Compliant
Unknown
RoHS Compliant
Yes
Row Spacing
1.35mm
Series
IMPACT
Shrouded
Fully
Stackable
No
Tail Length
1.4mm
Termination
Press-Fit
Underplate Material
Nickel
Voltage Rating (AC)
30V
Width
16.7mm
Compliance
RoHS
Compliant
Datasheet
TE Connectivity 2007790-1 Datasheet
Download the complete datasheet for TE Connectivity 2007790-1 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.