240-position, 2-row vertical DIMM socket assembly for DDR3 SDRAM memory modules. Features press-fit termination with a 0.039-inch pitch and 0.075-inch row spacing. Copper alloy contacts are plated with gold and tin (0.76um plating thickness) for reliable connectivity. Nylon housing in black, with UL94 V-0 flammability rating, ensures durability. Lead-free and RoHS compliant.
MountingThrough Hole
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Technical Specifications
TE Connectivity 2013266-2 technical specifications.
General
Contact Material
Copper Alloy
Contact Plating
Gold, Tin, Matte
Contact Post Length
0.133inch
Depth
7.54mm
ELV
Compliant
Flammability Rating
UL94 V-0
Housing Color
Black
Insulation Material
Nylon
Lead Free
Lead Free
Memory Type
DDR3 SDRAM,
Mount
Through Hole
Number of Contacts
240
Number of Positions
240
Number of Rows
2
Orientation
Straight
Package Quantity
64
Packaging
Tray
PCB Mount Retention
With
Pitch
0.039inch
Plating Thickness
0.76um
Radiation Hardening
No
RoHS Compliant
Yes
Row Spacing
0.075inch
Termination
Solder
Compliance
RoHS
Compliant
Datasheet
TE Connectivity 2013266-2 Datasheet
Download the complete datasheet for TE Connectivity 2013266-2 to view detailed technical specifications.
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