
204-position, right-angle, surface-mount DDR3 SO DIMM socket for cable-to-board applications. Features copper alloy contacts with gold plating, rated for 500mA and 1.5V. Constructed with a black thermoplastic insulator and a frame for PCB mount retention. Operates across a wide temperature range from -67°C to 185°C.
TE Connectivity 2013297-1 technical specifications.
| Circuit Application | Power |
| Connector System | Cable-to-Board |
| Contact Current Rating | 500mA |
| Contact Material | Copper Alloy |
| Contact Plating | Gold |
| Depth | 26.5mm |
| ELV | Compliant |
| Flammability Rating | UL94 V-0 |
| Gender | Female |
| Housing Color | Black |
| Insulation Material | Thermoplastic |
| Length | 75.9mm |
| Max Operating Temperature | 185°C |
| Memory Type | DDR3 SDRAM, |
| Min Operating Temperature | -67°C |
| Mount | Surface Mount |
| Number of Contacts | 204 |
| Number of Positions | 204 |
| Number of Rows | 2 |
| Orientation | Right Angle |
| Package Quantity | 20 |
| Packaging | Tray |
| PCB Mount Retention | With |
| Pitch | 0.024inch |
| Radiation Hardening | No |
| RoHS Compliant | Yes |
| Row Spacing | 0.322inch |
| Sealable | No (Without) |
| Stack Height | 0.315inch |
| Termination | Solder |
| Voltage Rating | 1.5V |
| RoHS | Compliant |
Download the complete datasheet for TE Connectivity 2013297-1 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
