260-position right-angle surface-mount header for DDR4 SODIMM modules. Features a 5.2 mm (.205 inch) stack height, designed for board-to-board interconnect applications. This small outline connector facilitates direct PCB mounting.
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Technical Specifications
TE Connectivity 2309409-2 technical specifications.
Compliance
| RoHS | Yes |
| REACH | Compliant |
| Military Spec | True |
Datasheet
TE Connectivity 2309409-2 Datasheet
Download the complete datasheet for TE Connectivity 2309409-2 to view detailed technical specifications.
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