9-position, 1-row wire-to-board header receptacle with 3.96mm pitch. Features IDC termination for discrete and ribbon wire up to 18AWG. Contact current rating of 7A, with copper alloy contacts plated in gold, tin, and matte finishes. Housing is white, with an orange color accent, and the component is rated UL94 V-2 for flammability. Operating temperature range from -67°C to 221°C, with a voltage rating of 600V AC. Includes strain relief and contact retention.
Current Rating7A
MountingFree Hanging
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Technical Specifications
TE Connectivity 3-641168-9 technical specifications.
General
| Approvals | CSA |
| Backwall/Post Interruptions | No (Without) |
| Color | Orange |
| Connector System | Wire-to-Board |
| Contact Current Rating | 7A |
| Contact Gender | Female |
| Contact Material | Copper Alloy |
| Contact Plating | Gold, Tin, Matte |
| Contact Retention | Yes (With) |
| Contact Type | Female Socket |
| Current Rating | 7A |
| ELV | Compliant |
| Flammability Rating | UL94 V-2 |
| Height | 0.385inch |
| Housing Color | White |
| Insulation Diameter | 2.41mm |
| Lead Free | Not Applicable |
| Length | 35.66mm |
| Mating Alignment | No (Without) |
| Mating Retention | Yes (With) |
| Max Operating Temperature | 221°C |
| Min Operating Temperature | -67°C |
| Mount | Free Hanging |
| Number of Contacts | 9 |
| Number of Positions | 9 |
| Number of Rows | 1 |
| Package Quantity | 250 |
| Packaging | Bag |
| PCB Mount Alignment | No (Without) |
| PCB Mount Retention | Without |
| Pitch | 0.156inch |
| Plating Thickness | 0.76um |
| Radiation Hardening | No |
| RoHS Compliant | Yes |
| Sealable | No (Without) |
| Series | MTA-156 |
| Shrouded | No (Without) |
| Strain Relief | Yes (With) |
| Termination | IDC |
| Underplate Material | Nickel |
| Voltage Rating (AC) | 600V |
| Wire/Cable Gauge | 18AWG |
| Wire/Cable Type | Discrete, Ribbon |
Compliance
| RoHS | Compliant |
Datasheet
TE Connectivity 3-641168-9 Datasheet
Download the complete datasheet for TE Connectivity 3-641168-9 to view detailed technical specifications.
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