14-position, 1-row wire-to-board header and receptacle assembly featuring IDC termination for 26AWG wire. This free-hanging connector system offers a 7A current rating and 600V AC voltage rating, with copper alloy contacts plated in tin, matte over nickel underplate. The assembly includes strain relief and contact retention, with a 0.156-inch pitch and a white housing. Operating temperature range is -67°C to 221°C, with UL94 V-2 flammability rating and CSA approval.
Current Rating7A
MountingFree Hanging
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Technical Specifications
TE Connectivity 4-640435-4 technical specifications.
General
| Approvals | CSA |
| Backwall/Post Interruptions | No (Without) |
| Color | Blue |
| Connector System | Wire-to-Board |
| Contact Current Rating | 7A |
| Contact Gender | Female |
| Contact Material | Copper Alloy |
| Contact Plating | Tin, Matte |
| Contact Retention | Yes (With) |
| Contact Type | Female Socket |
| Current Rating | 7A |
| ELV | Compliant |
| Flammability Rating | UL94 V-2 |
| Height | 9.02mm |
| Housing Color | White |
| Insulation Diameter | 2.41mm |
| Lead Free | Not Applicable |
| Length | 55.47mm |
| Mating Alignment | No (Without) |
| Mating Retention | No (Without) |
| Max Operating Temperature | 221°C |
| Min Operating Temperature | -67°C |
| Mount | Free Hanging |
| Number of Contacts | 14 |
| Number of Positions | 14 |
| Number of Rows | 1 |
| Package Quantity | 125 |
| Packaging | Bag |
| PCB Mount Alignment | No (Without) |
| PCB Mount Retention | Without |
| Pitch | 0.156inch |
| Plating Thickness | 5.08um |
| Radiation Hardening | No |
| RoHS Compliant | Yes |
| Sealable | No (Without) |
| Series | MTA-156 |
| Shrouded | No (Without) |
| Strain Relief | Yes (With) |
| Termination | IDC |
| Underplate Material | Nickel |
| Voltage Rating (AC) | 600V |
| Wire/Cable Gauge | 26AWG |
| Wire/Cable Type | Discrete, Ribbon |
Compliance
| RoHS | Compliant |
Datasheet
TE Connectivity 4-640435-4 Datasheet
Download the complete datasheet for TE Connectivity 4-640435-4 to view detailed technical specifications.
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