Vertical mount, 1.5mm pitch, 4-position, 1-row male pin header for wire-to-board applications. Features a 2A contact current rating with tin-plated brass contacts and a 2.4mm mating length. Constructed with black nylon insulation and housing, it offers mating alignment and retention, with a maximum operating temperature of 221°C. This surface mount component is UL94 V-0 flammability rated and RoHS compliant, supplied in tape and reel packaging.
MountingSurface Mount
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Technical Specifications
TE Connectivity 5-292231-4 technical specifications.
General
| Approvals | CSA |
| Backwall/Post Interruptions | No (Without) |
| Color | Black |
| Connector System | Wire-to-Board |
| Contact Current Rating | 2A |
| Contact Finish - Mating | TIN |
| Contact Material | Brass |
| Contact Mating Length | 2.4mm |
| Contact Plating | Tin |
| Contact Retention | No (Without) |
| Contact Shape | Square |
| Contact Type | Male Pin |
| ELV | Compliant |
| Flammability Rating | UL94 V-0 |
| Gender | Male |
| Height | 0.272inch |
| Housing Color | Black |
| Insulation Color | Black |
| Insulation Diameter | 0.041inch |
| Insulation Material | Nylon |
| Length | 0.334inch |
| Mating Alignment | Yes (With) |
| Mating Retention | Yes (With) |
| Max Operating Temperature | 221°C |
| Min Operating Temperature | -22°C |
| Mount | Surface Mount |
| Number of Contacts | 4 |
| Number of Positions | 4 |
| Number of Rows | 1 |
| Package Quantity | 500 |
| Packaging | Tape and Reel |
| PCB Mount Alignment | No (Without) |
| PCB Mount Retention | Without |
| PCB Mounting Orientation | Vertical |
| PCB Thickness | 0.031inch |
| Pitch | 1.5mm |
| Radiation Hardening | No |
| RoHS Compliant | Yes |
| Sealable | No (Without) |
| Series | Mini CT |
| Shape | Rectangular |
| Termination | SMD/SMT |
| Width | 4.7mm |
| Wire/Cable Gauge | 24AWG |
| Wire/Cable Type | Discrete |
Compliance
| RoHS | Compliant |
Datasheet
TE Connectivity 5-292231-4 Datasheet
Download the complete datasheet for TE Connectivity 5-292231-4 to view detailed technical specifications.
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