24-position, single-row wire-to-board header and receptacle connector with 3.96mm pitch. Features female socket contacts made of copper alloy with gold, tin, and matte plating over nickel underplate, rated for 7A current and 600V AC. This IDC termination connector supports discrete and ribbon wire/cable up to 18AWG, with a strain relief and contact retention. Operating temperature range from -67°C to 221°C, with UL94 V-2 flammability rating and CSA approval.
Current Rating7A
MountingFree Hanging
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Technical Specifications
TE Connectivity 5-641168-4 technical specifications.
General
| Approvals | CSA |
| Backwall/Post Interruptions | No (Without) |
| Color | Orange |
| Connector System | Wire-to-Board |
| Contact Current Rating | 7A |
| Contact Gender | Female |
| Contact Material | Copper Alloy |
| Contact Plating | Gold, Tin, Matte |
| Contact Retention | Yes (With) |
| Contact Type | Female Socket |
| Current Rating | 7A |
| ELV | Compliant |
| Flammability Rating | UL94 V-2 |
| Height | 0.385inch |
| Housing Color | White |
| Insulation Diameter | 2.41mm |
| Lead Free | Not Applicable |
| Length | 95.1mm |
| Mating Alignment | No (Without) |
| Mating Retention | Yes (With) |
| Max Operating Temperature | 221°C |
| Min Operating Temperature | -67°C |
| Mount | Free Hanging |
| Number of Contacts | 24 |
| Number of Positions | 24 |
| Number of Rows | 1 |
| Package Quantity | 100 |
| Packaging | Bag |
| PCB Mount Alignment | No (Without) |
| PCB Mount Retention | Without |
| Pitch | 0.156inch |
| Plating Thickness | 0.76um |
| Radiation Hardening | No |
| RoHS Compliant | Yes |
| Sealable | No (Without) |
| Series | MTA-156 |
| Shrouded | No (Without) |
| Strain Relief | Yes (With) |
| Termination | IDC |
| Underplate Material | Nickel |
| Voltage Rating (AC) | 600V |
| Wire/Cable Gauge | 18AWG |
| Wire/Cable Type | Discrete, Ribbon |
Compliance
| RoHS | Compliant |
Datasheet
TE Connectivity 5-641168-4 Datasheet
Download the complete datasheet for TE Connectivity 5-641168-4 to view detailed technical specifications.
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