152-position, 2-row board-to-board header with 0.025-inch pitch, designed for surface mount termination. Features a 11.5A contact current rating, copper alloy contacts with tin matte plating, and supports 10Gbps data rates with differential signaling. Offers a 15.01mm height and 8mm width, with a 18mm stack height capability. Housing is black, UL94 V-0 rated, and the component is RoHS compliant and lead-free.
TE Connectivity 5767095-4 technical specifications.
| Boss | Yes (With) |
| Color | Black |
| Connector System | Board-to-Board |
| Contact Current Rating | 11.5A |
| Contact Material | Copper Alloy |
| Contact Plating | Tin, Matte |
| Data Rate | 10Gbps |
| Differential Signaling | Yes |
| ELV | Compliant |
| Flammability Rating | UL94 V-0 |
| Height | 15.0114mm |
| Housing Color | Black |
| Lead Free | Lead Free |
| Length | 63.45mm |
| Mated Stacking Heights | 31.9mm |
| Mating Alignment | Yes (With) |
| Mating Retention | No (Without) |
| Max Operating Temperature | 125°C |
| Min Operating Temperature | -55°C |
| Mount | Surface Mount |
| Number of Columns | 76 |
| Number of Contacts | 152 |
| Number of Positions | 152 |
| Number of Power Positions | 4 |
| Number of Rows | 2 |
| Number of Signal Positions | 152 |
| Package Quantity | 8 |
| Packaging | Rail/Tube |
| PCB Mount Alignment | Yes (With) |
| PCB Mount Retention | Without |
| PCB Mounting Orientation | Vertical |
| Pitch | 0.025inch |
| Plating Thickness | 6.35um |
| Radiation Hardening | No |
| RoHS Compliant | Yes |
| Series | MICTOR |
| Stack Height | 18mm |
| Stackable | Yes |
| Termination | SMD/SMT |
| Underplate Material | Nickel |
| Width | 8mm |
| RoHS | Compliant |
Download the complete datasheet for TE Connectivity 5767095-4 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.