This interconnection device is a single-position, single-row socket designed for through-hole, solder, and surface mount applications. Featuring gold-plated copper contacts, it operates within a temperature range of -55°C to 105°C and has a voltage rating of 300V AC. The device accommodates a board thickness of 0.03 inches, with a flange diameter of 0.041 inches and an inside diameter of 0.021 inches. Its straight orientation and solder termination facilitate reliable connections.
MountingThrough Hole, Solder, Surface Mount
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Technical Specifications
TE Connectivity 8-1437514-0 technical specifications.
General
| Board Thickness | 0.03inch |
| Contact Material | Copper |
| Contact Plating | Gold |
| ELV | Compliant |
| Flange Diameter | 0.041inch |
| Inside Diameter | 0.021inch |
| Lead Free | Not Applicable |
| Length | 2.54mm |
| Max Operating Temperature | 105°C |
| Min Operating Temperature | -55°C |
| Mount | Through Hole, Solder, Surface Mount |
| Mounting Style | SOCKET |
| Number of Contacts | 1 |
| Number of Positions | 1 |
| Number of Rows | 1 |
| Orientation | Straight |
| Package Quantity | 50000 |
| Packaging | Bulk |
| Pin Hole Diameter | 0.026inch |
| Radiation Hardening | No |
| RoHS Compliant | Yes |
| Series | HOLTITE |
| Termination | Solder |
| Voltage Rating (AC) | 300V |
Compliance
| RoHS | Compliant |
Datasheet
TE Connectivity 8-1437514-0 Datasheet
Download the complete datasheet for TE Connectivity 8-1437514-0 to view detailed technical specifications.
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