PackagefSC
Capacitance25(Typ)pF
MountingSurface Mount
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Technical Specifications
Toshiba DF2S6.8FS(TL3,T) technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package/Case
fSC
Lead Shape
Flat
Pin Count
2
PCB
2
Package Length (mm)
0.8
Package Width (mm)
0.6
Package Height (mm)
0.48
Seated Plane Height (mm)
0.48
Package Material
Plastic
Mounting
Surface Mount
Configuration
Single
Type
Zener
Direction Type
Uni-Directional
Maximum Working Voltage
5V
Maximum Clamping Voltage
9(Typ)V
Maximum Leakage Current
0.5uA
Capacitance
25(Typ)pF
Number of Elements per Chip
1
Min Operating Temperature
-55°C
Max Operating Temperature
150°C
Compliance
Cage Code
S0562
EU RoHS
Yes
HTS Code
8536308000
Schedule B
8536300000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2002/95/EC
Datasheet
Toshiba DF2S6.8FS(TL3,T) Datasheet
Download the complete datasheet for Toshiba DF2S6.8FS(TL3,T) to view detailed technical specifications.
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