PackageSSOP
MountingSurface Mount
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Technical Specifications
Toshiba TB62726AFG(EL,6B,M technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
SSOP
Package Description
Shrink Small Outline Package
Lead Shape
Gull-wing
Pin Count
24
PCB
24
Package Length (mm)
13
Package Width (mm)
6
Package Height (mm)
1.5
Package Weight (g)
0.29
Package Material
Plastic
Mounting
Surface Mount
High Level Output Current
-1000uA
Low Level Output Current
1000uA
Output Voltage
4(Max)V
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Max Operating Supply Voltage
5.5V
Maximum Power Dissipation
1000mW
Maximum Supply Current
40000uA
Min Operating Supply Voltage
3V
Typical Operating Supply Voltage
3.3|5V
Compliance
Cage Code
S0562
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
Toshiba TB62726AFG(EL,6B,M Datasheet
Download the complete datasheet for Toshiba TB62726AFG(EL,6B,M to view detailed technical specifications.
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