PackageTFBGA
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Technical Specifications
Toshiba TC58BYG0S3HBAI4 technical specifications.
General
Package/Case
TFBGA
Density
1Gb
Interface
Serial
Max Operating Temperature
85°C
Memory Type
SLC NAND,
Min Operating Temperature
-40°C
Operating Supply Voltage
1.8V
Packaging
Tray
Page Size
2KB
Radiation Hardening
No
RoHS Compliant
No
Compliance
RoHS
Not CompliantNo
Datasheet
Toshiba TC58BYG0S3HBAI4 Datasheet
Download the complete datasheet for Toshiba TC58BYG0S3HBAI4 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.