PackageTFBGA
Current30mA
MountingSurface Mount
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Technical Specifications
Toshiba TC58NYG0S3EBAI4 technical specifications.
General
Address Bus Width
1b
Package/Case
TFBGA
Density
1Gb
Interface
Serial
Max Operating Temperature
85°C
Min Operating Temperature
-40°C
Max Supply Voltage
1.95V
Memory Type
SLC NAND,
Min Supply Voltage
1.7V
Mount
Surface Mount
Operating Supply Voltage
1.8V
Packaging
Bulk
Page Size
2112B
Radiation Hardening
No
RoHS Compliant
No
Supply Current
30mA
Sync/Async
Synchronous
Word Size
8b
Compliance
RoHS
Not CompliantNo
Datasheet
Toshiba TC58NYG0S3EBAI4 Datasheet
Download the complete datasheet for Toshiba TC58NYG0S3EBAI4 to view detailed technical specifications.
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